Refurbished & Unused: 0021-01421 / 0040-02544 DPS Upper Chamber Body, Metal Etch - $16,000 - (Dayton, OH)
History of this Chamber:The unit pictured is the actual unit you will receive. It has been refurbished by APS Materials, Inc., from Dayton, Ohio, and includes a Certificate of Conformance, verifying the refurbishment was completed within the Original Equipment Manufacturer's guidelines. The chamber has been unused since the refurbishment. There is no hardware for this unit, though some parts may be available upon request, such as handles or covers. Two units are available. The second unit is in similar condition. Refurbishment Process:Strip the old coating by grit-blastBlend upper lip defects, o-ring groove smoothing, replace broken key-lock threaded insertsMachine the ID to remove pitting and defects of the previously failed coatingRe-Anodize per MIL-A-8625 Type III Hard Anodic Class I (Non-Dyed), DI-water sealedRe-Apply Nickel plating to the conductive surfaces per MIL-STD-865CRe-Coat with Metal Etch Chamber CoatingPolish to reduce surface roughness to 70-80 micro-inches Ra (for in-the-field cleaning purposes)Seal with anaerobic methacrylate esters (hard, inert sealer to penetrate & lock porosity)Clean in DI-ultrasonic process with nitrogen-purged baking to remove moisture, inside a Class 1k CleanroomVacuum Bag after argon backfilling to remove oxygen for shipment to the end user About APS Materials, Inc.:The OEM is Applied Materials and has co-operated with APS Materials since 1998 to offer a similar coating to the A-Coat, called the MEC-04 thermal-sprayed coating (Metal Etch Chamber coating, released in 2004). Similar Interchangeable Part Numbers: New 1/2 Coat: 0021-01421New Full Coat: 0040-02544Old P/N: 0021-09601 (anodized only)Old P/N: 0020-33802 (anodized only)Old P/N: 0040-61531 (Coated, alumina or yttria)Refurbished Half Coat: 0021-01421RRefurbished Full Coat: 0040-52662Poly Etch Anodize-only: 0020-33806 Rev P2International Schedule B: 8486.10.0000: Machines and apparatus for the manufacture of boules or wafers

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